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- ºê·£µå À̸§: zhengfurui
- ±Ù¿ø: CN (Á¤Ç°)
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OT004039(4*4)
product description
The OT (Micro) series is designed for small size and large voltage input applications. It is assembled with high-strength bismuth telluride thermoelectric material and high thermal conductivity and high insulation DBC (direct bonded copper) ceramics. Suitable for high voltage, low current, small size applications. Products of aluminum nitride and double-sided metallized ceramic substrates can be customized.
features , application fields
High performance, the maximum temperature difference is above 67 degrees
High reliability, general application life of more than 10 years, biological and medical instruments
High temperature resistance, suitable for 100 ¡É environment test and analysis instruments
Suitable for occasions with frequent cold and heat shocks
High fineness flatness (¡¾0.02mm) Cooling of electronic components such as CPU
Comply with RoSH requirements and provide customized services
Installation attention
¡á Use direct current (DC) power supply; the voltage/current should be less than the maximum voltage/current of the device;
¡á The cooling sheet should be installed on the hot-end radiator before use. Generally, fans and radiators are used to dissipate heat or water-cooled heat dissipation;
¡á Use and save in an environment less than 100¡É;
¡á Pay attention to the force balance during installation to prevent side pressure or any form of impact;
¡á This product is suitable for temperature cycles from 0 to 60¡ÆC. If it is used in a wide range of temperature cycles, a corresponding life test needs to be done;
Quick product selection
1. Determine whether the cooling object (space, liquid, solid) has a heat source, and what is the heating power;
2. What is the ambient temperature (¡ÆC) used and the target temperature (¡ÆC) of the cooling object; Items 1 and 2 quickly determine whether semiconductor refrigeration chips are suitable.
3. Determine the maximum product size that the product can be applied to. From the perspective of performance, the larger the size, the better the cooling effect;
4. If the cooling power is required to be large, you can consider using multiple slices in series and parallel;
5. If the input voltage exceeds 12V, it is recommended to consider the scheme of using multiple chips in series;
6. The better the heat dissipation effect, the better the cooling effect;
7. The greater the temperature difference, the lower the cooling efficiency;
The four main performance parameters of semiconductor refrigerators refer to:
Maximum current Imax: refers to the constant hot surface temperature Th, when the load Qc is 0, the current value when ¥ÄT reaches ¥ÄTmax is the maximum current value.
Maximum current Umax: refers to the constant hot surface temperature Th, when the load Qc is 0, the voltage value when ¥ÄT reaches ¥ÄTmax is the maximum voltage value.
Maximum temperature difference ¥ÄTmax: When the heat absorption of the cold surface is 0, the temperature of the hot surface is constant, and when I=Imax, the maximum temperature difference between the cold surface and the hot surface can be reached.
Maximum heat absorption QCmax: constant hot surface temperature, when the temperature difference between the cold surface and the hot surface ¥ÄT=0, when I=Imax, the cooling surface can absorb the heat.
Process test project
¡Ü Thermoelectric material resistance, thermal resistance, Seebeck coefficient test
¡Ü Wafer height dimensional tolerance
¡Ü Metallization layer adhesion test
¡Ü Solderability test of metallization layer
¡Ü Die PN test
¡Ü Ceramic chip crack test
¡Ü Solder joint welding quality test
¡Ü The device`s maximum temperature difference, resistance, and maximum cooling capacity measurement
Reliability Test Standard
¡Ü YiLeng Technology Refrigeration Sheet follows the following standard tests:
¡Ü American military standard: MIL-SDT-883E
¡Ü Communication industry standard: Telcordia GR-468
¡Ü Temperature cycler test standard
Reliability Test Project
¡Ü ?Óøâà???(Temperature Cycling)
¡Ü ?Óø????(Thermal Shock Testing)
¡Ü ÍÔ??ðí(High Temperature Storage)
¡Ü ?×µ÷×,?âà???(Power On/Off Cycling Test)
¡Ü ïáÚãú¾?×µâà???(Reverse Power Cycling Test)
¡Ü ÏõÌþ????(Mechanical Shock Testing)
¡Ü ??òÉ???(Variable Frequency Vibration Testing)
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